Book Image

Architecting High-Performance Embedded Systems

By : Jim Ledin
4 (1)
Book Image

Architecting High-Performance Embedded Systems

4 (1)
By: Jim Ledin

Overview of this book

Modern digital devices used in homes, cars, and wearables contain highly sophisticated computing capabilities composed of embedded systems that generate, receive, and process digital data streams at rates up to multiple gigabits per second. This book will show you how to use Field Programmable Gate Arrays (FPGAs) and high-speed digital circuit design to create your own cutting-edge digital systems. Architecting High-Performance Embedded Systems takes you through the fundamental concepts of embedded systems, including real-time operation and the Internet of Things (IoT), and the architecture and capabilities of the latest generation of FPGAs. Using powerful free tools for FPGA design and electronic circuit design, you’ll learn how to design, build, test, and debug high-performance FPGA-based IoT devices. The book will also help you get up to speed with embedded system design, circuit design, hardware construction, firmware development, and debugging to produce a high-performance embedded device – a network-based digital oscilloscope. You’ll explore techniques such as designing four-layer printed circuit boards with high-speed differential signal pairs and assembling the board using surface-mount components. By the end of the book, you’ll have a solid understanding of the concepts underlying embedded systems and FPGAs and will be able to design and construct your own sophisticated digital devices.
Table of Contents (15 chapters)
1
Section 1: Fundamentals of High-Performance Embedded Systems
5
Section 2: Designing and Constructing High-Performance Embedded Systems
10
Section 3: Implementing and Testing Real-Time Firmware

Post-assembly board cleaning and inspection

It is best to clean excess flux from the board shortly after soldering is complete. If the flux has an opportunity to dry out, it can be difficult or impossible to remove the residue.

If your solder paste is of the no-clean variety, you may choose not to remove the residue. No-clean solder paste leaves behind a limited quantity of flux residue, and this material is non-corrosive. It may be more difficult to remove the residue of this type of flux than to remove rosin flux.

Rosin flux should be cleaned from the board after soldering. This includes work done with rosin core solder wire and with liquid or pen-applied flux. The reasons why cleaning is necessary are as follows:

  • Flux residue is visually unappealing. Rosin flux residue is a clear, shiny material with a yellow color that users of the device will notice. Customers purchasing the product may raise concerns about the quality of construction if it is present.
  • The residue...