Book Image

Architecting High-Performance Embedded Systems

By : Jim Ledin
4 (1)
Book Image

Architecting High-Performance Embedded Systems

4 (1)
By: Jim Ledin

Overview of this book

Modern digital devices used in homes, cars, and wearables contain highly sophisticated computing capabilities composed of embedded systems that generate, receive, and process digital data streams at rates up to multiple gigabits per second. This book will show you how to use Field Programmable Gate Arrays (FPGAs) and high-speed digital circuit design to create your own cutting-edge digital systems. Architecting High-Performance Embedded Systems takes you through the fundamental concepts of embedded systems, including real-time operation and the Internet of Things (IoT), and the architecture and capabilities of the latest generation of FPGAs. Using powerful free tools for FPGA design and electronic circuit design, you’ll learn how to design, build, test, and debug high-performance FPGA-based IoT devices. The book will also help you get up to speed with embedded system design, circuit design, hardware construction, firmware development, and debugging to produce a high-performance embedded device – a network-based digital oscilloscope. You’ll explore techniques such as designing four-layer printed circuit boards with high-speed differential signal pairs and assembling the board using surface-mount components. By the end of the book, you’ll have a solid understanding of the concepts underlying embedded systems and FPGAs and will be able to design and construct your own sophisticated digital devices.
Table of Contents (15 chapters)
1
Section 1: Fundamentals of High-Performance Embedded Systems
5
Section 2: Designing and Constructing High-Performance Embedded Systems
10
Section 3: Implementing and Testing Real-Time Firmware

Reflow soldering and hand soldering

At this point, the PCB sits on your assembly workspace, fully populated with SMT components. Now, it is time to turn on your reflow oven or hot plate.

Reflow soldering

Regardless of what type of reflow system you use, exercise extreme care when moving the PCB from your workspace to the oven or hot plate. If you strike the board against an object or, worse, drop it, you are likely to find that all your hard work placing the components was done for naught.

Your level of involvement during reflow soldering depends greatly on the technical capabilities of your reflow system. If you are using a stock hot plate or toaster oven, it is entirely up to you to monitor the state of the PCB as the solder heats and melts. If you remove the board from the heat too soon, you will have areas of unmelted solder, which means electrical contact will be poor to nonexistent, and parts may fall off the board. If you wait too long to remove the board from the heat...